It would be very useful to be able to enter HPB and Extruder temperature offsets into Process Settings. I have Thermistors in both the HPB and the Hot Block which I have characterized using a Thermocouple meter. The temperatures are in error by between 4 and 6 degrees C. Furthermore, the HPB offsets swing wildly depending upon the bed surface materials; glass only versus PEI/Glass laminate ( Glass is a good conductor while PEI is pretty bad and the surface temperature difference is about 10C ). Some of us use different HPB materials depending upon the filament employed.
Being able to pre-load these offsets into the slicer would simplify and help avoid oversights and mistakes.
