Interesting use of S3D processes to improve interlayer adhesion
Posted: Mon Feb 19, 2024 4:54 am
by jstrom
An interesting technique proposed by Stefan from CNC kitchen using S3D.
Currently, and to my knowledge, S3D is the only slicer that can handle this.
https://www.youtube.com/watch?v=5hGm6cubFVs&t=11s
Re: Interesting use of S3D processes to improve interlayer adhesion
Posted: Fri Apr 05, 2024 4:33 am
by joseleung
The crack features on the brick printed parts strongly implies increased vertical and horizontal bonding, leading to increased homogeneity, which is why the failures were 3d and not 2d. The 45 degree oriented bonding in the brick prints is notable in this regard.
Re: Interesting use of S3D processes to improve interlayer adhesion
Posted: Mon Apr 22, 2024 9:48 am
by S3D-Jason
That's a really neat use the process system in S3D! There's all sorts of things can you configure using the processes that you just can't typically do with other programs. I know we have used it to run all sorts of other similar experiments internally so it's really powerful once you get the hang of it.